IEEE Transactions on Electromagnetic Compatibility

Cynde Reid Gustafson wrote:
From: "Cynde Reid Gustafson" <nj@ccat.sas.upenn.edu>
Subject: Electromagnetic Compatibility, IEEE Transactions on 
Date: Sat, 19 Jan 2002 14:06:26 -0500

Electromagnetic Compatibility, IEEE Transactions on

http://ieeexplore.ieee.org/lpdocs/epic03/RecentIssues.htm?punumber=15
(Link inactive 22 April 2005)

http://ieeexplore.ieee.org/xpl/RecentIssue.jsp?punumber=15
(Link active 22 April 2005)

Most recent contents include:

- Foreword: special issue on "recent advances in EMC of printed circuit
boards"
- Parasitic modes on printed circuit boards and their effects on EMC and
signal integrity
- DC power-bus modeling and design with a mixed-potential integral-equation
formulation and circuit extraction
- Analysis of power/ground-plane EMI decoupling performance using the
partial-element equivalent circuit technique
- Frequency-dependent losses on high-performance interconnections
- Transmission-line parameter approximation for digital simulation
- Wavelet-based high-order adaptive modeling of lossy interconnects
- A SPICE model for incident field coupling to lossy multiconductor
transmission lines
- Frequency-domain-coupled microstrip-line normal-mode parameter extraction
from S-parameters
- An equivalent transmission-line model containing dispersion for high-speed
digital lines-with an FDTD implementation
- A simple method for measuring the relative permittivity of printed circuit
board materials
- A genetic algorithm based method for source identification and far-field
radiated emissions prediction from near-field measurements for PCB
characterization
- Assessment of digital integrated-circuit electromagnetic emission based on
radiated power evaluation
- EMI mitigation with multilayer power-bus stacks and via stitching of
reference planes
- Electrical behavior of decoupling capacitors embedded in multilayered PCBs

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